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SIIA Público
SISTEMA INTEGRAL DE INFORMACIÓN ACADÉMICA - PÚBLICO
Título del libro: Proceedings Of The Asme Summer Heat Transfer Conference, 2016, Vol 2 Título del capítulo: HEAT SINK PERFORMANCE IMPROVEMENT BYWAY OF NANOFLUIDS
The new generation of integrated-circuit chips demands novel cooling
techniques for enhancing device performance. Air-cooling techniques are
not sufficient anymore to reach the necessary dissipation for these
devices while liquid-cooling techniques have proved to be an efficient
solution. The addition of nanoparticles to conventional cooling fluid
changes its thermo-physical properties based on the type of the particle
material, base fluid, particle volume fraction and size, pumping power,
etc. The present study proposes a flow field pattern for a
nanofluid-cooled heat sink in order to improve the heat transfer and the
flow distribution based on a new design. Al2O3- water nanofluid is the
working fluid. The results show the comparison between the simple
conventional use of water and the use of a nanofluid, by way of
implementing critical factors for performance evaluation: thermal
resistance, temperature uniformity, highest base temperature, and
pressure drop. The analysis enables to determine that the heat sink
thermal performance is definitely improved by the use of a nanofluid.
