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Título del libro: Electrochemical And Performance Testing Of Nano Engineered-Coatings Based On Ana Presence When Exposed To Corrosive Environment
Título del capítulo: Thermal and electrical properties of infiltrated high volume fraction Si3N4 and Si3N4-coated SiO2 preforms by Al-Mg-Si alloys as heat sink materials in electronic packaging

Autores UNAM:
NILOOFAR SOLTANI; AMIN BAHRAMI;
Autores externos:

Idioma:
Inglés
Año de publicación:
2016
Palabras clave:

Aluminum; Aluminum alloys; Aluminum coatings; Electric conductivity; Electronics packaging; Expansion; Fiber optic sensors; Heat sinks; Preforming; Silica; Silicon; Silicon alloys; Silicon nitride; Silicon oxides; Electrical conductivity; Optimum processing conditions; Pressureless infiltration; Processing parameters; Rice husk ash; Taguchi experimental design; Thermal and electrical properties; Thermal expansion coefficients; Thermal expansion


Resumen:

The effect of processing parameters on the pressureless infiltration of Si3N4 and coated SiO2 preforms by aluminum alloys has been investigated. The effect of atmosphere, infiltration time, temperature, porosity of perform, and Si3N4 coating on the SiO2 particles, on the pressureless infiltration of rice husk ash preforms with aluminum, was investigated and quantified via a Taguchi experimental design and ANOVA. The contributions of each of the parameters and of their interactions on the electrical conductivity and thermal expansion coefficient of the composites were determined. Processing conditions for obtaining optimum electrical conductivity and thermal expansion coefficient were projected. In addition, the projected electrical conductivity and thermal expansion coefficient obtainable under optimum processing conditions were experimentally validated. The maximum and minimum values for electrical resistivity and coefficient of thermal expansion, by using the optimized process are 1.37 ×10-3 O.m and 5.3 ×10-6(/°C) for Si3N4 and coated SiO2 infiltrated composite, respectively. © 2016 MS and T16®.


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